AMD Opteron 2212 (F3)

The AMD Opteron 2212 (F3) is a dual-core, dual-thread server/workstation processor from the Santa Rosa generation, built on AMD's K8 architecture with a 90 nm process. It runs at a fixed 2000.00 MHz base clock with no boost capability, carries a 95 W TDP, and mounts on the AMD Socket F platform. Released in August 2006, it is now end-of-life, with a launch MSRP of $377. The database records no individual benchmark results for this part; its average benchmark score is 0, and its percentile versus all CPUs is 50.

Single-Thread vs Multi-Thread Behavior

The Opteron 2212 (F3) presents a clean split between single-threaded and multi-threaded execution. With exactly two cores and two threads — one thread per core — the processor cannot execute more than two software threads concurrently. The base clock of 2000.00 MHz is the sole frequency; there is no boost clock to transiently raise speed when only one thread is active. This means a single-threaded workload runs at a flat 2.00 GHz with no headroom, while a two-thread workload gets the same 2.00 GHz on each core. Any workload that needs more than two threads will stall on thread count, not clock speed.

The cache layout reinforces this split. Each core has 128 KB of L1 cache and 1 MB of L2 cache, both private to that core. There is no L3 cache, so data shared between the two cores must travel through the memory subsystem rather than a shared on-die pool. For single-threaded code, the full 1 MB L2 is available as a private resource, which is beneficial for working sets that fit within that capacity. For multi-threaded code, the two cores operate independently, but any inter-core communication incurs memory latency.

The memory interface is dual-channel DDR2 with a peak bandwidth of 10.7 GB/s. With two cores contending for the same memory bus, the effective per-core bandwidth is roughly half the aggregate under sustained all-core load, though the exact distribution depends on access patterns. The integrated memory controller on the K8 architecture reduces latency compared to older front-side bus designs, but the bandwidth ceiling remains fixed at 10.7 GB/s.

Real-world implications: a lightly threaded database query or a single-threaded compilation step will run at 2.00 GHz with a private 1 MB L2, but a heavily threaded render or simulation will be capped at two threads. The lack of a boost clock also means the processor cannot adapt to thermal or power headroom — every thread always runs at the same fixed frequency. This makes performance predictable but leaves single-threaded burst work on the table.

Power and Thermals

The 95 W TDP defines the cooling class. This is a moderate power envelope for a 2006-era server processor, implying a standard active heatsink with forced airflow — a copper-core aluminum fin stack or a heatpipe tower in a workstation chassis, not a passive solution and not an extreme dual-tower unit. The 90 nm process node spreads 227 million transistors across a 235 mm² die, which gives a relatively large contact area for the heatsink and moderate thermal density.

Because there is no boost clock, power draw is highly predictable. Under sustained all-core load, the processor will sit near its 95 W TDP; at idle, with both threads parked, it drops to a lower state. The integrated memory controller adds a constant baseline draw, and ECC memory support — standard for the server segment — means the controller must handle parity-checking logic, which slightly raises the minimum power floor compared to non-ECC parts.

The absence of dynamic frequency scaling simplifies thermal validation. The worst-case heat load is exactly the TDP, so a cooler sized for 95 W sustained dissipation is sufficient. In a 1U or 2U rack server, the standard active heatsink with a small forced-air fan meets the thermal design point, provided chassis airflow is adequate. The Socket F package uses a large heat spreader, which aids heat transfer to the cooler base.

The 90 nm process is not efficient by modern standards, but the large die area of 235 mm² helps distribute heat. The 95 W TDP also means the processor does not require exotic cooling — a mainstream server cooler is adequate. The locked multiplier (the part number is OSA2212GAA6CX) further reinforces that this is a fixed-frequency part with no overclocking headroom, so the thermal solution only needs to handle the stock 95 W envelope.

Benchmark Performance

The database lists no benchmark scores for the Opteron 2212 (F3). The average benchmark score is recorded as 0, and the percentile versus all CPUs is 50. This combination is telling: a percentile of 50 with a zero average score indicates the rank is a placeholder based on the part's position in the database, not a measured performance result. No absolute performance figure can be cited from the data.

The 50th percentile places the processor at the exact median of all CPUs in the database. However, given the zero average score, this should be interpreted cautiously — it does not reflect a measured performance result. The processor's actual performance relative to contemporaries must be inferred from architectural characteristics: two K8 cores at 2000.00 MHz, 1 MB L2 per core, and dual-channel DDR2 at 10.7 GB/s.

The nearestRivals array is empty, so there are no deltaPct values and no rival names to report. No direct percentage comparisons can be made to any other processor. This is common for end-of-life server parts that predate the database's benchmark collection window. The data simply does not include comparative figures for this entry.

What the data does support: the K8 core was a competitive server core in its era, and 2000.00 MHz was a mid-range clock speed for the Opteron lineup. The dual-channel memory bus at 10.7 GB/s was standard for the platform. The 95 W TDP and 90 nm process place it in a specific power/performance class. But without recorded benchmark scores, any numeric performance claim beyond the base clock, cache configuration, and memory bandwidth would be unsupported by the data.

FAQ

Q: How many cores and threads does the AMD Opteron 2212 (F3) have?

A: It has 2 cores and 2 threads, with one thread per core.

Q: What is the base clock speed and is there a boost clock?

A: The base clock is 2000.00 MHz. There is no boost clock, so the processor runs at a fixed 2.00 GHz under all conditions.

Q: What is the TDP and what cooling does it imply?

A: The TDP is 95 W, which implies a standard active server heatsink with forced airflow — not a passive cooler and not an extreme dual-tower unit.

Q: Does it support ECC memory?

A: Yes, ECC memory is supported. The memory type is DDR2, running dual-channel with a total bandwidth of 10.7 GB/s.

Q: What is the process node and die size?

A: The process node is 90 nm, with 227 million transistors on a 235 mm² die.

Q: What is the launch MSRP?

A: The launch MSRP was $377.

Q: Is there a benchmark score for this processor?

A: The database records an average benchmark score of 0, and the percentile versus all CPUs is 50. No individual benchmark results are listed.

How It Compares

The nearestRivals field for the AMD Opteron 2212 (F3) is empty. The database does not list any comparable processors for this part, so no rival names, scores, or deltaPct values are available. This means the Opteron 2212 (F3) cannot be positioned against any specific competitor using the current data. The only positional reference is the 50th percentile versus all CPUs, which places it at the median of the database's CPU population — though the zero average benchmark score indicates no measured performance data underlies that rank.

Without rival entries, comparative analysis is limited to architectural facts: dual K8 cores at 2000.00 MHz, 1 MB L2 per core, dual-channel DDR2 at 10.7 GB/s, and a 95 W TDP. These characteristics define its class — a mid-2000s dual-core server processor — but the database does not supply the comparative performance figures needed to quantify how it stacks up against any specific alternative. The end-of-life status and August 2006 release date further indicate that this part belongs to an earlier generation of server hardware, for which the database currently holds no rival comparison data. The part number OSA2212GAA6CX and the locked multiplier confirm it is a fixed-frequency, non-overclockable server part, which narrows its positioning to the stock server segment rather than enthusiast or overclocking territory.