AMD

AMD Mobile Athlon 64 3400+

AMD processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
82W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 1C / 1T
Base Clock 2.2 GHz
TDP 82W
Architecture K8
Socket AMD Socket 754
nm
Process 130 nm
Released Aug 2005

AMD Mobile Athlon 64 3400+ Specifications

Mobile Athlon 64 3400+ Core Configuration

Processing cores and threading

The AMD Mobile Athlon 64 3400+ features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Mobile Athlon 64 3400+ Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Mobile Athlon 64 3400+ benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Mobile Athlon 64 3400+ by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.2 GHz
Boost Clock
N/A
Multiplier
11x

AMD's Mobile Athlon 64 3400+ Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Mobile Athlon 64 3400+ processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Mobile Athlon 64 3400+'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
1 MB

K8 Architecture & Process

Manufacturing and design details

The AMD Mobile Athlon 64 3400+ is built on AMD's 130 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Mobile Athlon 64 3400+ incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Clawhammer
Process Node
130 nm
Transistors
106 million
Die Size
193 mm²
Generation
Mobile Athlon 64 (ClawHammer)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Mobile Athlon 64 3400+ by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
AMD64

Mobile Athlon 64 3400+ Power & Thermal

TDP and power specifications

The AMD Mobile Athlon 64 3400+ has a TDP (Thermal Design Power) of 82W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
82W

AMD Socket 754 Platform & Socket

Compatibility information

The Mobile Athlon 64 3400+ uses the AMD Socket 754 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket 754
Package
µPGA
DDR5

AMD Socket 754 Memory Support

RAM compatibility and speeds

Memory support specifications for the Mobile Athlon 64 3400+ define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Mobile Athlon 64 3400+ determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR1
Memory Bus
Single-channel

AMD's Mobile Athlon 64 3400+ Integrated Graphics

Built-in GPU specifications

The AMD Mobile Athlon 64 3400+ includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Mobile Athlon 64 3400+ provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Mobile Athlon 64 3400+ Product Information

Release and pricing details

The AMD Mobile Athlon 64 3400+ is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Mobile Athlon 64 3400+ by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Aug 2005
Market
Mobile
Status
End-of-life
Part Number
AMA3400BEX5APAMA3400BEX5AR

Mobile Athlon 64 3400+ Benchmark Scores

No benchmark data available for this CPU.

About AMD Mobile Athlon 64 3400+

The AMD Mobile Athlon 64 3400+ is a single-core, single-thread mobile processor from the 3000 series. It uses the K8 architecture under the Clawhammer codename and is listed as part of the Mobile Athlon 64 (ClawHammer) generation. The CPU runs on AMD Socket 754, has a base clock of 2.20 GHz, and no boost clock in the data. Its cache is 128 KB L1 and 1 MB L2, with no L3. Memory support is DDR1 over a single-channel bus, and ECC memory is not supported. The TDP is 82 W. The production status is end-of-life. The database entry records no benchmark scores, an average benchmark score of 0, and a percentileVsAllCpus value of 50. The nearestRivals list is empty.

Single-Thread vs Multi-Thread Behavior

With 1 core and 1 thread, this processor has no parallel execution hardware. The multi-thread side of the comparison is therefore not a reduced-capability mode; it is absent. A workload that distributes work across multiple threads will still execute on that single thread. No simultaneous execution of multiple threads is possible. The data shows a base clock of 2.20 GHz and no boost clock, so the single frequency figure is the sole reference point. For single-threaded code, the entire 128 KB L1 and 1 MB L2 resources are available to the one execution context. There is no L3 cache listed, and the vCache3d field is also null, so there is no extra stacked cache layer in this record. The cache hierarchy ends at 1 MB L2.

This configuration favors workloads that can complete within one thread, such as older or lightly threaded applications. It does not favor compilation, rendering, or any workload that expects multiple cores. A background task and a foreground task would be competing for the same single thread rather than running on separate cores. The base clock of 2.20 GHz is the only clock frequency in the data, and with no boost clock there is no higher frequency state recorded. The single-thread vs multi-thread split in the data is fully one-sided. Real-world performance character will be dominated by single-thread execution, because there is no second thread to absorb any parallel work.

Power and Thermals

The TDP is 82 W. That thermal design point defines the cooling class: any system using this CPU must be able to handle an 82 W envelope. The physical data behind this TDP includes a 130 nm process, 106 million transistors, and a 193 mm² die size. The processor is in the mobile market segment, which places this 82 W envelope inside a portable chassis. A cooling solution for this part therefore needs to move heat away from a compact space, but the data does not list cooler dimensions, fan specifications, or chassis requirements.

The architecture is K8, and the generation is Mobile Athlon 64 (ClawHammer). The process node is 130 nm, the only manufacturing geometry in the record. The 106 million transistor count on a 193 mm² die provides context for the 82 W TDP: this is a transistor budget and die area that require active thermal management. The foundry field is null, so the silicon manufacturer is not identified in the data. No memory bandwidth figure is listed, and no PCIe data is listed, so those fields do not contribute to the thermal analysis. Memory support is DDR1 over a single-channel bus, and ECC is not supported, which means the platform does not carry the extra thermal overhead of ECC operation. The cooling tier implied by the data is the tier appropriate for an 82 W mobile chip.

Benchmark Performance

The benchmarks array is empty. The average benchmark score is 0. In the percentileVsAllCpus field, this CPU is placed at 50. A 50th percentile position is the midpoint of the database's all-CPU ranking. However, because there are no benchmark scores and no nearestRivals entries, this percentile cannot be connected to any measured workload result. The data provides no exact percentage deltas to any rival. There are no rival names, no rival scores, and no deltaPct values in the FACT PACK. Thus, a performance analysis based on measured scores is not possible from this record.

What remains is specification-level interpretation: a single thread at 2.20 GHz, with 128 KB L1, 1 MB L2, and DDR1 single-channel memory. These specifications define the shape of possible performance, but they do not replace benchmark data. The 0 average score is not a performance measurement; it is the absence of measurement. The 50th percentile is a positional flag, not a tested score. The empty benchmarks array and the empty nearestRivals array together mean there is no measured score against which this CPU's performance can be placed. No further numeric performance claims can be derived from the record.

Who Should Consider It

Given the production status is end-of-life, the realistic audience is someone maintaining an existing AMD Socket 754 mobile system. The CPU's single-core, single-thread design means it is best suited to applications that use one thread. Office-style document work that does not require parallel processing would fall into that category, but the database has no office benchmark to confirm a specific experience. Creation workloads that depend on multi-threading will see only one thread. Rendering and similar parallel tasks would queue work on that one thread rather than spread it across cores. Gaming is not benchmarked in this record.

The integrated graphics field is listed as "On certain motherboards (Chipset feature)", which means display output depends on the motherboard or chipset, not on the CPU itself. Anyone building or repairing a system should therefore pair this processor with a Socket 754 motherboard that provides the needed graphics. The memory path is DDR1 and single-channel, and ECC is not supported, so the platform memory configuration is fixed by those parameters. The mobile segment and end-of-life status together indicate that this is not a current platform. Users who need more than one thread should look elsewhere; the 1-core/1-thread design is a hard constraint.

How It Compares

The nearestRivals field is an empty array. There are no nearest rivals listed for this CPU. No rival names, no rival benchmark scores, and no deltaPct values are present. Consequently, there is no rival-by-rival comparison to construct from the FACT PACK. The only comparative position available is percentileVsAllCpus at 50. This places the CPU at the midpoint of all CPUs in the database, but because the benchmark array is empty and the average score is 0, that midpoint is a database metadata position rather than a measured competitive result. The empty nearestRivals array is itself a data point: the database has not assigned competitive relationships for this processor. In the absence of nearestRivals, no named CPU comparison can be made from the data. The comparison story is therefore simple: the database does not define a competitive set for the Mobile Athlon 64 3400+.

FAQ

Q: What socket does the processor use?

A: It uses AMD Socket 754.

Q: How many cores and threads does it have?

A: It has 1 core and 1 thread.

Q: What is the memory configuration?

A: It supports DDR1 memory through a single-channel memory bus. ECC memory is not supported.

Q: What cache does it have?

A: The cache is 128 KB L1 and 1 MB L2. No L3 cache is listed.

Q: Does the CPU include integrated graphics?

A: The data lists integrated graphics as "On certain motherboards (Chipset feature)", so graphics depend on the motherboard or chipset rather than on the CPU.

Q: What is the manufacturing process and TDP?

A: The process node is 130 nm, with 106 million transistors on a 193 mm² die. The TDP is 82 W.

The Intel Equivalent of Mobile Athlon 64 3400+

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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