AMD EPYC Embedded 8324P

The AMD EPYC Embedded 8324P is a server and workstation processor in the EPYC 8004 series. It uses AMD Socket SP6, the Zen 4c architecture, and the Siena codename. The record lists 32 cores, 64 threads, a base clock value of 2.65, a boost clock value of 3.00, and a TDP of 180. The benchmarks array is empty, the average benchmark score is 0, and the nearestRivals array contains no entries. The only comparative field is percentileVsAllCpus = 50. This analysis therefore relies on the specification fields and the percentile value.

Benchmark Performance

The benchmarks array is empty. No workload or suite results are attached to this CPU in the database. The avgBenchmarkScore field is 0. Because the benchmark array is empty, the 0 is a missing-data marker rather than a measured performance score. There is no benchmark evidence for any specific application.

The percentileVsAllCpus field is 50. That value positions the EPYC Embedded 8324P at the midpoint of the percentile ordering of all CPUs in the database. A 50th percentile is a rank, not a workload score. It does not state the distance to any other processor.

The specification fields define the performance context in place of benchmark scores. The CPU has 32 cores and 64 threads. The base clock value is 2.65, and the boost clock value is 3.00. The cache hierarchy is 64 KB of L1 per core, 1 MB of L2 per core, and 128 MB of shared L3. The architecture is Zen 4c. These fields describe a high-core-count processor with a large shared L3 cache and per-core cache allocations. The data does not include a measured score to show how that configuration translates into actual workload performance.

Because nearestRivals contains no entries, no rival scores and no percentage deltas are available. No rival name is listed in the record, and no direct lead or deficit can be quantified. The only cross-CPU signal in the data is the 50th percentile field. Any benchmark comparison against a specific processor would require information beyond this record.

Power and Thermals

The TDP field is 180. This makes the processor a 180 W TDP class component. The TDP is the only thermal number in the record; there are no measured power or temperature figures. A platform using this part needs a cooling solution designed for the 180 W TDP class.

The semiconductor context for this thermal envelope includes a 5 nm process node, TSMC as the foundry, a transistor count of 35,500 million, and a die size of 4x 73 mm². The architecture generation is EPYC with Zen 4c and the Siena codename. The market segment is server and workstation, so the 180 W envelope is positioned for embedded server use. No cooler or heatsink model is specified in the data, and no thermal benchmark results are available to validate the TDP under load.

The process and die data are recorded as manufacturing facts: 5 nm, TSMC, 35,500 million transistors, and 4x 73 mm². These figures are the only physical design details that accompany the 180 W TDP. The thermal class is therefore defined solely by the TDP field and the operating context implied by the server and workstation market segment.

How It Compares

The nearestRivals array is empty. There are no rival processors to describe and no rival benchmark scores to quote. The market segment is recorded as server and workstation, but no processor from that segment appears as a named rival in the data.

The only comparison value is percentileVsAllCpus = 50. A 50th percentile position is exactly the midpoint of the percentile ordering in the database. It does not identify which CPUs sit above or below that point. It does not provide a percentage difference to another part.

Because the average benchmark score is 0, this percentile is not supported by a measured score in this record. Therefore, the comparison section cannot provide a per-rival paragraph for any competitor. The data cannot support statements such as "ahead of" or "behind" a named processor. The only quantitative comparison statement possible from the data is that the EPYC Embedded 8324P sits at the 50th percentile of all CPUs in the database percentile field.

Platform and Compatibility

AMD Socket SP6 is the physical socket. The EPYC 8004 series is the product family, and the generation is EPYC with Zen 4c architecture and the Siena codename. The part number is 100-000001417. Production status is active. The release date is 2023-09-17.

| Specification | Recorded Value |

|---|---|

| Socket | AMD Socket SP6 |

| Architecture | Zen 4c |

| Codename | Siena |

| Cores | 32 |

| Threads | 64 |

| Base clock | 2.65 |

| Boost clock | 3.00 |

| TDP | 180 |

| L1 cache | 64 KB (per core) |

| L2 cache | 1 MB (per core) |

| L3 cache | 128 MB (shared) |

| Memory support | DDR5 |

| Memory bus | Six-channel |

| Memory bandwidth | 230.4 GB/s |

| ECC memory | True |

| PCIe | Gen 5, 96 lanes (CPU only) |

| Market segment | Server/Workstation |

| Production status | Active |

Memory support is DDR5. The memory bus is six-channel. The memory bandwidth is 230.4 GB/s. ECC memory support is recorded as true. These fields define the memory platform as DDR5 with a six-channel bus, 230.4 GB/s aggregate bandwidth, and ECC capability.

PCIe support is Gen 5 with 96 lanes listed as CPU only. No integrated graphics are listed; the integratedGraphics field is null. The multiplierUnlocked field is false, so the processor is not multiplier-unlocked. The recorded platform boundaries are AMD Socket SP6, DDR5 memory, and Gen 5 PCIe with 96 CPU lanes.

Upgrade path information in the data is limited to the fields above. The socket field lists AMD Socket SP6, so a platform must be built around that socket. Production status is active, meaning the part is still listed as active in the database. No other socket, chipset, or platform generation is recorded. Memory expansion follows the six-channel DDR5 configuration, and PCIe expansion follows the Gen 5, 96-lane CPU-only specification.

FAQ

Q: What benchmark scores are available for the EPYC Embedded 8324P?

A: The benchmarks array is empty, and the average benchmark score is 0. The only ranking field is percentileVsAllCpus = 50.

Q: How many cores and threads does the processor have?

A: It has 32 cores and 64 threads.

Q: What memory and PCIe capabilities are recorded?

A: Memory support is DDR5 with a six-channel memory bus and 230.4 GB/s bandwidth. ECC memory is supported. PCIe is Gen 5 with 96 lanes listed as CPU only.

Q: What is the TDP and cooling class?

A: The TDP is 180, placing it in the 180 W TDP class.

Q: What socket and architecture are listed?

A: The socket is AMD Socket SP6. The architecture is Zen 4c, and the codename is Siena.

Q: Is the multiplier unlocked?

A: No; the multiplierUnlocked field is false.

Q: What are the cache sizes?

A: L1 cache is 64 KB per core, L2 cache is 1 MB per core, and L3 cache is 128 MB shared.