AMD

AMD EPYC Embedded 8324P

AMD processor specifications and benchmark scores

32
Cores
64
Threads
3
GHz Boost
180W
TDP
🛡️ECC Memory

AMD EPYC Embedded 8324P Specifications

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EPYC Embedded 8324P Core Configuration

Processing cores and threading

The AMD EPYC Embedded 8324P features 32 physical cores and 64 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
32
Threads
64
SMP CPUs
1
⏱️

EPYC Embedded 8324P Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in EPYC Embedded 8324P benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC Embedded 8324P by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.65 GHz
Boost Clock
3 GHz
All-Core Turbo
3.0 GHz
Multiplier
26.5x
💾

AMD's EPYC Embedded 8324P Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the EPYC Embedded 8324P processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC Embedded 8324P's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
1 MB (per core)
L3 Cache
128 MB (shared)
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Zen 4c Architecture & Process

Manufacturing and design details

The AMD EPYC Embedded 8324P is built on AMD's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC Embedded 8324P incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 4c
Codename
Siena
Process Node
5 nm
Foundry
TSMC
Transistors
35,500 million
Die Size
4x 73 mm²
Generation
EPYC (Zen 4c (Siena))
🔢

Zen 4c Instruction Set Features

Supported CPU instructions and extensions

The EPYC Embedded 8324P by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
AVX-512
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
🔌

EPYC Embedded 8324P Power & Thermal

TDP and power specifications

The AMD EPYC Embedded 8324P has a TDP (Thermal Design Power) of 180W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
180W
Configurable TDP
155-225 W
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AMD Socket SP6 Platform & Socket

Compatibility information

The EPYC Embedded 8324P uses the AMD Socket SP6 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket SP6
PCIe
Gen 5, 96 Lanes(CPU only)
Package
FC-LGA4844
DDR5

AMD Socket SP6 Memory Support

RAM compatibility and speeds

Memory support specifications for the EPYC Embedded 8324P define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC Embedded 8324P determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Six-channel
Memory Bandwidth
230.4 GB/s
ECC Memory
Supported
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EPYC Embedded 8324P Product Information

Release and pricing details

The AMD EPYC Embedded 8324P is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC Embedded 8324P by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2023
Market
Server/Workstation
Status
Active
Part Number
100-000001417
Bundled Cooler
None

EPYC Embedded 8324P Benchmark Scores

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No benchmark data available for this CPU.

About AMD EPYC Embedded 8324P

The AMD EPYC Embedded 8324P is a powerhouse with 32 cores and 64 threads, built on the cutting-edge Zen 4c (Siena) architecture and a 5nm process node. While its core density rivals high-end server CPUs, its lack of benchmark data leaves room for speculation on how it might perform in gaming-adjacent tasks like streaming or content creation. The chip’s shared 128MB L3 cache ensures efficient data access across cores, but its base clock of 2.65 GHz and turbo boost up to 3.00 GHz suggest a focus on sustained throughput rather than aggressive single-threaded speed. Gamers accustomed to desktop CPUs might find its frequencies modest, though embedded systems prioritizing stability and multi-threaded efficiency could benefit from its design.

Performance frequencies on the AMD EPYC Embedded 8324P lean into reliability, with a base clock of 2.65 GHz ensuring consistent execution across its 32 cores. The 3.00 GHz turbo provides a modest uplift for burstier workloads, though without benchmark results, it’s unclear if this chip can match the responsiveness of consumer-grade processors. Its 180W TDP hints at robust thermal headroom for sustained performance in embedded environments, where uninterrupted operation trumps peak spikes. Gamers demanding single-core dominance might overlook this part, but those curious about server-class hardware could appreciate its balance of core count and controlled power limits.

Thermal design for this processor centers on managing its 180W TDP within dense embedded systems, leveraging AMD Socket SP6’s infrastructure for scalable cooling solutions. While consumer CPUs often target air-cooled simplicity, the 8324P’s design assumes advanced thermal management, possibly liquid cooling or optimized airflow in industrial setups. This focus on reliability over extreme overclocking aligns with embedded applications needing 24/7 uptime, but it sacrifices the flashy thermal agility gamers expect in desktop rigs. The chip’s release in September 2023 positions it as a modern option for specialized hardware, albeit unproven in mainstream performance tests.

The memory subsystem of AMD’s EPYC Embedded 8324P, though unspecified here, likely inherits the family’s DDR5 support and PCIe 5.0 capabilities, critical for handling massive data pipelines in multi-threaded scenarios. Paired with its 32-core configuration, this chip excels in workloads like virtualization, cloud computing, or AI inference, where parallelism and memory bandwidth reign supreme. Gamers won’t find it in their rigs anytime soon its architecture prioritizes throughput over low-latency responsiveness but it could indirectly boost gaming ecosystems via backend server optimization. As an embedded solution tailored for edge computing and industrial servers, the 8324P represents AMD’s push to scale Zen 4c’s efficiency into non-traditional markets.

The Intel Equivalent of EPYC Embedded 8324P

Looking for a similar processor from Intel? The Intel Core i5-14600KF offers comparable performance and features in the Intel lineup.

Intel Core i5-14600KF

Intel • 14 Cores

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