AMD EPYC Embedded 3351

The AMD EPYC Embedded 3351 is a 12-core, 24-thread server/workstation processor built on the Zen architecture, fabricated on a 14 nm process by GlobalFoundries. It occupies the 50th percentile among all CPUs in the database, indicating a squarely mid-range standing, though its benchmark profile is defined by a zero average score, meaning its practical performance is best understood through its architectural and platform characteristics rather than raw test results.

Benchmark Performance

The EPYC Embedded 3351 presents a unique case in the benchmark database: its `avgBenchmarkScore` is 0, and it has no recorded `benchmarks` entries. This absence of direct scores means the data cannot show a percentage delta against any rival, as the `nearestRivals` list is empty. However, the percentile field (`percentileVsAllCpus: 50`) places it exactly at the median of all tracked CPUs, signaling that its expected performance tier is neither entry-level nor flagship within the database’s broader population.

Without direct scores, the processor’s compute potential must be inferred from its core configuration. The 12 cores and 24 threads, combined with a base clock of 1900.00 MHz and a boost clock of 3.00 GHz, suggest a design tuned for sustained multi-threaded workloads rather than peak single-core bursts. The shared 32 MB L3 cache (with 96 KB L1 and 512 KB L2 per core) provides a substantial pool for data reuse, which typically benefits server-style tasks such as virtualization, database queries, and compilation. In the absence of rival deltas, the data indicates that this chip will likely trail modern high-core-count parts but outpace older dual-core or quad-core embedded processors—though no percentages can be cited from the pack to quantify that gap.

Benchmark results for this class of embedded silicon are often sparse, so the zero score may reflect a lack of standardized testing rather than a performance deficiency. The architecture’s 14 nm node and dual-die design (2x 213 mm², totaling 4,800 million transistors) point to a mature, power-conscious design that prioritizes consistency over peak throughput. For workloads that scale linearly with threads, the 24-thread count is the primary lever; however, the 1900.00 MHz base clock means lightly-threaded tasks will see modest single-core performance, likely below the 3.00 GHz boost ceiling only under favorable thermal conditions.

Who Should Consider It

The EPYC Embedded 3351 is positioned for always-on server and workstation environments where reliability and ECC memory support outweigh raw speed. The 12 cores and 24 threads make it a fit for virtualization hosts running multiple moderate-sized VMs, as the thread count allows concurrent guest workloads without oversubscription. The 32 MB shared L3 cache is advantageous for in-memory databases or caching layers where repeated access to a working set is common.

For content creation, the 24 threads will accelerate rendering tasks that use CPU-based ray tracing or video encoding, but the 1900.00 MHz base clock means interactive editing in software that relies on single-thread responsiveness (e.g., timeline scrubbing) will feel less snappy. Office productivity suites, which typically use two to four threads, will run adequately but offer no advantage over lower-core embedded parts; the processor’s strength lies in throughput, not latency. Network security appliances or storage servers, which benefit from the 64 PCIe Gen 3 lanes for high-speed I/O, are a natural fit—the CPU can drive numerous NVMe drives or network interface cards without a separate chipset bottleneck.

Gaming is not a primary use case, as the integrated graphics only appear “on certain motherboards (Chipset feature),” and the dual-channel DDR4 memory bus (42.7 GB/s bandwidth) limits memory-intensive titles. However, for a game server hosting many players, the 24 threads and ECC memory provide stability and headroom for plugin-heavy mods. The 50th percentile ranking suggests it will handle mainstream server duties competently, but users chasing maximum frame rates or sub-millisecond latency should look elsewhere—no rival names or scores are available to compare directly.

Platform and Compatibility

The EPYC Embedded 3351 uses the AMD BGA SP4r2 socket, which is a soldered, non-upgradeable interface—meaning the CPU is permanently attached to the motherboard. This is typical for embedded parts, prioritizing compactness and thermal robustness over user serviceability. The processor supports DDR4 memory in a dual-channel configuration, with a theoretical bandwidth of 42.7 GB/s. ECC memory is enabled, a critical feature for long-running servers where bit-flips can corrupt data.

PCIe connectivity is provided via Gen 3 with 64 lanes from the CPU only, a generous allocation that allows multiple high-bandwidth peripherals without sharing lanes. This is a standout feature: many server processors offer fewer lanes or require a chipset to expand connectivity. The 64 lanes can be partitioned for dual 10GbE network controllers, several NVMe SSDs, and a RAID controller simultaneously. There is no integrated GPU on the CPU package; any display output relies on the motherboard’s chipset feature, so a dedicated graphics adapter or BMC (baseboard management controller) is necessary for console access.

The architecture is Zen (codename Snowy Owl), and the processor is part of the EPYC 3001 series, which is designed for embedded and edge deployments rather than datacenter racks. The production status is Active, indicating ongoing availability. The release date is 2018-02-20, so the platform is several generations old, but the 64 PCIe lanes and ECC support remain relevant for industrial and telecom applications. The socket is not shared with consumer Ryzen platforms, so upgrade paths are limited to other SP4r2 embedded parts—though the pack does not list any compatible siblings. The memory bus is dual-channel, which is narrower than the quad-channel found in larger EPYC parts, but for embedded workloads with 42.7 GB/s bandwidth, it is sufficient for most I/O-bound tasks.

How It Compares

The `nearestRivals` array is empty in the FACT PACK, so no direct comparison to specific named processors can be made. The data provides no rival scores, names, or deltaPct values to reference. This absence is notable: it suggests the EPYC Embedded 3351 occupies a niche where standardized benchmarks are rarely run, or where its closest competitors are not tracked in the same database. Without rival data, the 50th percentile ranking is the sole positional reference, indicating that half of all CPUs in the database are expected to outperform it and half underperform—though this is a coarse measure given the zero benchmark score.

In the absence of named rivals, the comparison must be qualitative based on the processor’s own specifications. Against newer embedded parts with higher clock speeds or more cores, the 3351 would likely lag in multi-core throughput, but its 64 PCIe lanes and ECC support may give it an I/O advantage. Against older server chips with similar core counts, the 14 nm process and 32 MB L3 cache could offer better power efficiency per thread. The dual-die design (2x 213 mm²) implies a multi-chip module, which can increase latency between dies but also allows for higher yields—though no performance deltas can be cited.

The lack of rivals also means no price-based positioning can be discussed, and the `launchMsrp` field is null, so no cost data exists in the pack. The processor’s value is thus tied to its feature set: 12 cores, 24 threads, 64 PCIe lanes, and ECC support in a low-TDP package. For system integrators who need a fixed, reliable compute node with extensive I/O, this chip fills a specific role that consumer or mainstream server parts may not match—but without benchmark scores, a numerical comparison is impossible.

Power and Thermals

The EPYC Embedded 3351 has a TDP of 80 watts, which classifies it as a low-to-mid power server processor. This TDP, combined with the 1900.00 MHz base clock, indicates a design aimed at passive or low-noise cooling solutions common in embedded chassis. The 14 nm process from GlobalFoundries helps keep power leakage in check, and the dual-die layout spreads heat across two 213 mm² dies, which can aid thermal dissipation if the heatsink covers both.

An 80-watt TDP implies a capable air cooler is sufficient—typically a low-profile heatsink or a small active fan, depending on ambient conditions. No cooler is included in the FACT PACK, so integrators must supply one that matches the socket’s mechanical constraints. The boost clock of 3.00 GHz will drive higher power draw transiently, but the 80-watt envelope suggests the processor is designed to sustain near-boost on multiple cores without exceeding thermal limits, given a reasonable airflow. For fanless applications, chassis design must account for the sustained thermal load, but the TDP is modest enough for standard embedded enclosures.

The power characteristics also influence memory and I/O: with 42.7 GB/s bandwidth and 64 PCIe lanes, the memory controllers and PCIe PHYs add to the total system power, but the CPU’s 80-watt figure is the reference point for cooling design. In a 1U server or ruggedized industrial PC, a single blower fan over a heatpipe cooler would suffice. The processor’s Active production status and 2018 release date mean that thermal solutions from that era remain compatible, though newer coolers with better fin density can reduce acoustic noise. Overall, the 80-watt TDP places the EPYC Embedded 3351 in a sweet spot for embedded systems where power budgets are tight but performance needs exceed typical Atom or Xeon-D entry parts.