AMD

AMD EPYC Embedded 3255

AMD processor specifications and benchmark scores

8
Cores
16
Threads
3.1
GHz Boost
55W
TDP
๐Ÿ–ฅ๏ธIntegrated GPU ๐Ÿ›ก๏ธECC Memory

AMD EPYC Embedded 3255 Specifications

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EPYC Embedded 3255 Core Configuration

Processing cores and threading

The AMD EPYC Embedded 3255 features 8 physical cores and 16 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
8
Threads
16
SMP CPUs
1
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EPYC Embedded 3255 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in EPYC Embedded 3255 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC Embedded 3255 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.5 GHz
Boost Clock
3.1 GHz
Multiplier
25x
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AMD's EPYC Embedded 3255 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the EPYC Embedded 3255 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC Embedded 3255's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
96 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
16 MB (shared)
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Zen Architecture & Process

Manufacturing and design details

The AMD EPYC Embedded 3255 is built on AMD's 14 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC Embedded 3255 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen
Codename
Zen
Process Node
14 nm
Foundry
GlobalFoundries
Transistors
4,800 million
Die Size
213 mmยฒ
Generation
EPYC Embedded (Zen (Snowy Owl))
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Zen Instruction Set Features

Supported CPU instructions and extensions

The EPYC Embedded 3255 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
XFR
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EPYC Embedded 3255 Power & Thermal

TDP and power specifications

The AMD EPYC Embedded 3255 has a TDP (Thermal Design Power) of 55W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
55W
Tj Max
105ยฐC
Configurable TDP
25-55 W
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AMD BGA SP4r2 Platform & Socket

Compatibility information

The EPYC Embedded 3255 uses the AMD BGA SP4r2 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD BGA SP4r2
PCIe
Gen 3, 32 Lanes(CPU only)
Package
SP4r2
DDR5

AMD BGA SP4r2 Memory Support

RAM compatibility and speeds

Memory support specifications for the EPYC Embedded 3255 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC Embedded 3255 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
Memory Bus
Dual-channel
Memory Bandwidth
42.7 GB/s
ECC Memory
Supported
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AMD's EPYC Embedded 3255 Integrated Graphics

Built-in GPU specifications

The AMD EPYC Embedded 3255 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the EPYC Embedded 3255 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)
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EPYC Embedded 3255 Product Information

Release and pricing details

The AMD EPYC Embedded 3255 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC Embedded 3255 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Feb 2018
Market
Server/Workstation
Status
Active
Part Number
PE3255BGR88AF
Bundled Cooler
None

EPYC Embedded 3255 Benchmark Scores

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No benchmark data available for this CPU.

About AMD EPYC Embedded 3255

The AMD EPYC Embedded 3255, part of AMDโ€™s embedded processor lineup launched in early 2018, delivers solid performance for edge computing and compact server environments. Built on the 14 nm Zen (Snowy Owl) architecture, this 8-core, 16-thread processor runs at a base clock of 2.50 GHz and boosts up to 3.10 GHz when needed. With a modest 55W TDP, itโ€™s well-suited for systems where thermal efficiency and sustained workloads matter think industrial servers, network appliances, or ruggedized data center nodes. While no public benchmark data exists, real-world expectations place it competitively against other mid-tier embedded CPUs of its era, particularly in multi-threaded tasks like virtualization or data routing. The 16 MB of shared L3 cache helps maintain responsiveness across workloads, and the BGA SP4r2 socket ensures compatibility with specialized motherboards designed for high availability and long-term deployment. As the AMD EPYC Embedded 3255 isnโ€™t designed for consumer desktops, users should expect a focus on reliability over peak speed, making it a dependable choice for headless or remote infrastructure applications.

  1. Workstation performance is limited due to its embedded nature donโ€™t expect smooth 4K video editing or real-time 3D rendering, but light development, file serving, or containerized apps run efficiently.
  2. The AMD EPYC Embedded 3255 (AMD) shines in price-to-performance for niche markets where longevity, ECC memory support, and multi-core throughput are valued over gaming or consumer software optimization.
  3. It lacks integrated graphics, so systems must include a discrete GPU or rely on remote display solutions common in server environments but a caveat for DIY users.
  4. Compatibility hinges on SP4r2 BGA motherboards, which restricts upgrades and requires full board replacement, limiting flexibility compared to socketed consumer CPUs.
  5. While not a mainstream processor, the 3255 offers a cost-effective entry into the EPYC ecosystem for OEMs building secure, scalable edge servers with long-term support.
  6. As an embedded solution, it trades peak performance for stability, making the AMD EPYC Embedded 3255 (AMD) ideal for always-on infrastructure rather than burst-intensive desktop tasks.

The Intel Equivalent of EPYC Embedded 3255

Looking for a similar processor from Intel? The Intel Core i5-8600 offers comparable performance and features in the Intel lineup.

Intel Core i5-8600

Intel โ€ข 6 Cores

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