AMD

AMD EPYC 8124PN

AMD processor specifications and benchmark scores

16
Cores
32
Threads
3
GHz Boost
100W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 16C / 32T
Boost Clock 3 GHz
Base Clock 2000 GHz
L3 Cache 64 MB (shared)
TDP 100W
Architecture Zen 4c
Socket AMD Socket SP6
nm
Process 5 nm
Released Sep 2023

AMD EPYC 8124PN Specifications

EPYC 8124PN Core Configuration

Processing cores and threading

The AMD EPYC 8124PN features 16 physical cores and 32 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
16
Threads
32
SMP CPUs
1

EPYC 8124PN Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in EPYC 8124PN benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC 8124PN by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
3 GHz
All-Core Turbo
2.9 GHz
Multiplier
20x

AMD's EPYC 8124PN Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the EPYC 8124PN processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC 8124PN's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
1 MB (per core)
L3 Cache
64 MB (shared)

Zen 4c Architecture & Process

Manufacturing and design details

The AMD EPYC 8124PN is built on AMD's 5 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC 8124PN incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 4c
Codename
Siena
Process Node
5 nm
Foundry
TSMC
Transistors
17,750 million
Die Size
2x 73 mm²
Generation
EPYC (Zen 4c (Siena))

Zen 4c Instruction Set Features

Supported CPU instructions and extensions

The EPYC 8124PN by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
AVX-512
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT

EPYC 8124PN Power & Thermal

TDP and power specifications

The AMD EPYC 8124PN has a TDP (Thermal Design Power) of 100W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
100W

AMD Socket SP6 Platform & Socket

Compatibility information

The EPYC 8124PN uses the AMD Socket SP6 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket SP6
PCIe
Gen 5, 96 Lanes(CPU only)
Package
FC-LGA4844
DDR5

AMD Socket SP6 Memory Support

RAM compatibility and speeds

Memory support specifications for the EPYC 8124PN define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC 8124PN determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR5
Memory Bus
Six-channel
Memory Bandwidth
230.4 GB/s
ECC Memory
Supported

EPYC 8124PN Product Information

Release and pricing details

The AMD EPYC 8124PN is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC 8124PN by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2023
Launch Price
$790
Market
Server/Workstation
Status
Active
Part Number
100-000001166
Bundled Cooler
None

EPYC 8124PN Benchmark Scores

No benchmark data available for this CPU.

About AMD EPYC 8124PN

The AMD EPYC 8124PN is a 16-core, 32-thread server processor from the EPYC 8004 series, built on the Zen 4c architecture (codename Siena) and fabricated by TSMC on a 5 nm process. It operates at a 2000.00 MHz base clock with a 3.00 GHz boost, carries a 100 W TDP, and targets the AMD Socket SP6 platform. With a launch MSRP of $790, it is positioned as an efficiency-focused part for the server and workstation segment, and it sits at the 50th percentile among all CPUs tracked in this database.

How It Compares

The FACT PACK for the EPYC 8124PN contains no nearestRivals entries, so no direct rival names, scores, or deltaPct values are available for comparison. Benchmark results indicate an average benchmark score of 0, meaning the database currently holds no measured performance samples for this part. The 50th percentile placement places it exactly at the median of the tracked CPU field — not a leading part, but not a laggard either. Without recorded rival scores, its competitive position must be inferred from its specification sheet rather than from head-to-head runs.

In the broader server/workstation landscape, the 8124PN's 16 cores and 32 threads place it in a moderate core-count tier, while its 100 W TDP and Zen 4c design point toward density and power efficiency rather than raw multi-core dominance. The six-channel DDR5 memory interface with 230.4 GB/s bandwidth and 96 PCIe Gen 5 lanes give it an I/O profile that competes on throughput per watt. Because no nearestRivals data is supplied, the analysis cannot cite percentage deltas against named competitors; the practical takeaway is that this processor occupies a mid-position in the overall CPU hierarchy, with specifications tailored for power-conscious server deployments.

Who Should Consider It

The EPYC 8124PN is best suited for workloads that leverage its 16 cores and 32 threads in a power-constrained environment. Server virtualization, containerized microservices, and cloud-native workloads benefit from the combination of moderate core count and low 100 W TDP, allowing higher core density per rack compared to higher-power parts. The six-channel DDR5 memory with 230.4 GB/s bandwidth and ECC support makes it a strong candidate for memory-bandwidth-sensitive tasks such as in-memory databases, data analytics, and scientific computing where data integrity is non-negotiable. The 96 PCIe Gen 5 lanes (CPU only) provide ample headroom for high-throughput NVMe storage arrays, GPU accelerators, and high-speed networking cards, making this part suitable for storage servers and AI inference nodes that need fast I/O without excessive power draw.

For gaming, this is not a typical desktop choice; its SP6 socket and server segment target professional platforms, and the 3.00 GHz boost clock is modest for gaming workloads that favor high single-thread frequency. Office productivity and general business computing would be severely underutilized by this part — the 16-core design and server memory architecture are overkill for such tasks, and the platform cost and power envelope are optimized for always-on data center operation rather than interactive desktop use. The absence of integrated graphics reinforces its server-only positioning; a discrete GPU is mandatory for any display output, which further distances it from mainstream consumer use cases. In short, the 8124PN is for operators building efficient, dense servers where memory bandwidth, ECC reliability, and PCIe lane count matter more than raw clock speed.

Power and Thermals

The EPYC 8124PN has a TDP of 100 W, placing it in the low-power class for server processors. This modest thermal envelope means a capable air cooler is sufficient for most installations; no liquid cooling or exotic thermal solutions are implied by the data. The Zen 4c architecture, designed for efficiency, reinforces this — the 5 nm process and 17,750 million transistors are arranged in a 2x 73 mm² die configuration, which spreads heat across two chiplets and aids thermal dissipation. In a dense server chassis, this 100 W TDP allows for higher per-rack core counts and simplifies cooling design, as standard server heatsinks and chassis airflow can handle the thermal load without special accommodations. The low power draw also reduces operational strain on power delivery systems, making the 8124PN a fit for environments where thermal headroom and energy budgets are tightly managed. No cooler size or wattage figures beyond the 100 W TDP are provided in the FACT PACK, so cooling recommendations remain qualitative: a standard server air cooler within the SP6 platform's specifications will suffice.

FAQ

Q: What socket does the AMD EPYC 8124PN use?

A: It uses AMD Socket SP6, which is specific to the EPYC 8004 series.

Q: What memory type and channel configuration does it support?

A: It supports DDR5 memory in a six-channel configuration, with a total memory bandwidth of 230.4 GB/s and ECC support enabled.

Q: How many cores and threads does the 8124PN have?

A: It has 16 cores and 32 threads, with a base clock of 2000.00 MHz and a boost clock of 3.00 GHz.

Q: What is the process node and foundry?

A: It is built on a 5 nm process at TSMC, with a transistor count of 17,750 million and a die size of 2x 73 mm².

Q: Does it have integrated graphics?

A: No, the FACT PACK lists no integrated graphics, so a discrete GPU is required for any display output.

Q: Is the CPU multiplier unlocked?

A: No, the multiplierUnlocked field is false, meaning the part is not designed for overclocking.

Benchmark Performance

The average benchmark score for the EPYC 8124PN is 0, and the benchmarks array in the FACT PACK is empty, so there are no recorded performance runs to analyze. The 50th percentile placement among all CPUs is the only comparative metric available, indicating a median position in the overall database. Without rival scores or deltaPct values, exact percentage comparisons are impossible; however, the specification sheet offers interpretive signals. The 16 cores at a 3.00 GHz boost clock, paired with 64 MB of shared L3 cache and 1 MB L2 per core, suggest solid multi-threaded throughput for its power class. The six-channel DDR5 interface at 230.4 GB/s bandwidth provides a wide memory pipe that can feed all 16 cores effectively in bandwidth-bound workloads. The 2000.00 MHz base clock is conservative, which aligns with the 100 W TDP and efficiency-oriented Zen 4c design; sustained all-core loads will likely run closer to base than boost, but the large shared L3 cache helps mitigate latency in cache-resident workloads. In the absence of measured scores, the data supports a characterization of this part as a balanced, mid-tier server CPU — capable of strong memory and I/O throughput, but not a clock-speed champion. The 50th percentile ranking, while not flattering, reflects that the database includes many higher-performance consumer and enterprise parts; within its own efficiency niche, the 8124PN's value lies in its low power draw and high lane count rather than raw benchmark supremacy.

Platform and Compatibility

The EPYC 8124PN is part of the EPYC 8004 series (codename Siena) and is built on the Zen 4c architecture. It uses AMD Socket SP6, a platform designed specifically for this efficiency-focused server family. Memory support is DDR5 in a six-channel configuration, with ECC enabled and a total bandwidth of 230.4 GB/s. The processor provides 96 PCIe Gen 5 lanes (CPU only), which is a substantial amount of high-speed I/O for connecting storage, networking, and accelerators. The production status is Active, and the release date is 2023-09-17. The part number is 100-000001166, and the multiplier is locked, indicating no overclocking support. There is no integrated graphics, so a discrete GPU is necessary for any video output. The platform's upgrade path is defined by the SP6 socket — within the EPYC 8004 family, users can select from other SKUs in the same generation, but the socket is not shared with mainstream consumer platforms. The 5 nm process and TSMC foundry relationship are fixed attributes of the silicon, and the 2x 73 mm² die configuration with 17,750 million transistors underscores the dual-chiplet design. For system integrators, the key compatibility considerations are the SP6 socket, DDR5 six-channel memory boards, and PCIe Gen 5 infrastructure — all of which are standard for the EPYC 8004 generation. The active production status ensures ongoing availability for new server builds.

The Intel Equivalent of EPYC 8124PN

Looking for a similar processor from Intel? The Intel Core i5-14600KF offers comparable performance and features in the Intel lineup.

Intel Core i5-14600KF

Intel • 14 Cores

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