AMD

AMD EPYC 7663P

AMD processor specifications and benchmark scores

56
Cores
112
Threads
3.5
GHz Boost
240W
TDP
ECC Memory

At a Glance

AMD
Cores / Threads 56C / 112T
Boost Clock 3.5 GHz
Base Clock 2000 GHz
L3 Cache 256 MB (shared)
TDP 240W
Architecture Zen 3
Socket AMD Socket SP3
nm
Process 7 nm
Released Sep 2023

AMD EPYC 7663P Specifications

EPYC 7663P Core Configuration

Processing cores and threading

The AMD EPYC 7663P features 56 physical cores and 112 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
56
Threads
112
CCDs
8
Cores per CCD
8
SMP CPUs
1

EPYC 7663P Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in EPYC 7663P benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The EPYC 7663P by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2000 GHz
Boost Clock
3.5 GHz
Multiplier
20x

AMD's EPYC 7663P Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the EPYC 7663P processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The EPYC 7663P's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
256 MB (shared)

Zen 3 Architecture & Process

Manufacturing and design details

The AMD EPYC 7663P is built on AMD's 7 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in EPYC 7663P incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Zen 3
Codename
Milan
Process Node
7 nm
Foundry
TSMC
Transistors
33,200 million
Die Size
8x 81 mm²
Generation
EPYC (Zen 3 (Milan))

Zen 3 Instruction Set Features

Supported CPU instructions and extensions

The EPYC 7663P by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
SSE4.1
SSE4.2
AES
AVX
AVX2
BMI1
BMI2
SHA
F16C
FMA3
AMD64
AMD-V
SMAP
SMEP
SMT
Precision Boost 2
XFR 2

EPYC 7663P Power & Thermal

TDP and power specifications

The AMD EPYC 7663P has a TDP (Thermal Design Power) of 240W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
240W
Configurable TDP
225-280 W

AMD Socket SP3 Platform & Socket

Compatibility information

The EPYC 7663P uses the AMD Socket SP3 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket SP3
PCIe
Gen 4, 128 Lanes(CPU only)
Package
FCLGA-4094
DDR5

AMD Socket SP3 Memory Support

RAM compatibility and speeds

Memory support specifications for the EPYC 7663P define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the EPYC 7663P determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR4
Memory Bus
Eight-channel
Memory Bandwidth
204.8 GB/s
ECC Memory
Supported

EPYC 7663P Product Information

Release and pricing details

The AMD EPYC 7663P is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the EPYC 7663P by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Sep 2023
Launch Price
$3139
Market
Server/Workstation
Status
Active
Part Number
100-000001284

EPYC 7663P Benchmark Scores

No benchmark data available for this CPU.

About AMD EPYC 7663P

AMD EPYC 7663P is a 56-core, 112-thread server processor built on the Zen 3 architecture, codenamed Milan, and designed for the AMD Socket SP3 platform. It operates with a base clock of 2000 MHz and a boost clock of 3500 MHz, drawing a 240W TDP, and is produced on TSMC's 7nm process with 33,200 million transistors across eight chiplets. The processor supports eight-channel DDR4 memory with a peak bandwidth of 204.8 GB/s, includes 256 MB of shared L3 cache, and offers 128 PCIe Gen 4 lanes, positioning it as a high-core-density option for dual-socket or single-socket enterprise deployments.

How It Compares

The data shows no nearest rivals are listed for the AMD EPYC 7663P in the benchmark database, meaning direct comparative scoring against specific competing models is not available from the information provided. The percentile versus all CPUs stands at 50, indicating that this processor sits at the midpoint of the performance distribution across all processors tracked, which is unusual given its core count but reflects the absence of benchmark scores in the entry. Without nearestRivals data, the EPYC 7663P cannot be placed against Intel Xeon or older EPYC parts using exact deltas, so any positional analysis must rely on its raw specifications alone.

The absence of rival comparisons underscores a gap in the database record, not a reflection of the processor's capability. With 56 cores and 112 threads, the EPYC 7663P belongs to a high-core-count tier where typical competitors would include other Milan-generation parts or Intel's Ice Lake-SP Xeons, but no scores are provided to quantify those relationships. The 50th percentile ranking, when paired with a zero average benchmark score, suggests that the entry is incomplete rather than indicative of mediocre performance, since a 56-core Zen 3 chip would normally rank far higher in a populated database.

Who Should Consider It

Workloads that scale with core count are the primary target for the EPYC 7663P, given its 56 cores and 112 threads. Server virtualization, large-scale database hosting, and scientific computing tasks that parallelize across many threads would benefit from the massive thread pool, especially when combined with 256 MB of shared L3 cache to reduce memory latency for working sets that fit within that capacity. The eight-channel DDR4 memory interface, delivering up to 204.8 GB/s of bandwidth, further supports memory-intensive applications like in-memory analytics or high-performance computing simulations that need to feed many cores simultaneously.

For creation professionals, the EPYC 7663P is suited for 3D rendering, video encoding, and code compilation where multi-threaded throughput is paramount, though the 2000 MHz base clock and 3500 MHz boost clock are modest compared to lower-core-count workstation chips, so lightly threaded tasks like UI interaction or single-threaded script execution will not be its strength. Office productivity and general desktop use are poor fits for this processor, as the high core count and server-oriented platform do not translate to snappy single-thread response, and the lack of integrated graphics means a discrete GPU is mandatory. The market segment classification of Server/Workstation confirms that this is not a consumer desktop part, so buyers should be in enterprise procurement or high-end workstation builders.

Benchmark Performance

No benchmark scores are recorded in the FACT PACK, so the average benchmark score is zero, and the percentile versus all CPUs is 50, which is a neutral midpoint. Without nearestRivals entries, there are no exact percentage deltas to analyze, leaving only the architectural specifications to infer performance. The 56-core count and 112-thread count, paired with a 3.50 GHz boost clock, suggest that multi-threaded workloads will see near-linear scaling in well-parallelized applications, potentially placing the EPYC 7663P in the top tier of server CPUs from its generation, but the data does not provide corroborating scores.

The absence of benchmark data is a limitation of the record, not the hardware. Because the EPYC 7663P shares the Zen 3 architecture with other Milan processors, its per-core IPC is consistent with that generation, meaning the primary differentiator is the core count and cache hierarchy. The 256 MB L3 cache is notably large and likely provides a significant advantage in cache-sensitive workloads, but without comparative scores against rivals, quantifying that advantage is impossible from the supplied material. The benchmark section, therefore, must be read as pending data rather than a performance verdict.

FAQ

Q: What is the socket type for the AMD EPYC 7663P?

A: The processor uses AMD Socket SP3, which is the standard platform for server-class EPYC processors.

Q: How much L3 cache does the EPYC 7663P have?

A: It has 256 MB of shared L3 cache, with 64 KB of L1 cache and 512 KB of L2 cache per core.

Q: Does the EPYC 7663P support ECC memory?

A: Yes, ECC memory is supported, and the processor uses DDR4 memory across an eight-channel bus.

Q: What is the production status of this processor?

A: The production status is listed as Active, meaning it is currently available for purchase.

Q: Is the EPYC 7663P overclockable?

A: No, the multiplier is locked, so the processor is not unlocked for overclocking.

Q: What is the release date and launch MSRP?

A: The release date is September 4, 2023, and the launch MSRP is $3139.

Power and Thermals

The EPYC 7663P has a TDP of 240 watts, which is a high power draw typical for a 56-core server processor operating at a 2000 MHz base clock. This TDP class requires a robust cooling solution, such as a high-end server-grade air cooler or a liquid cooling system designed for SP3 sockets, because the heat density from eight 81 mm² chiplets is substantial. The 7nm process from TSMC helps mitigate power consumption relative to older nodes, but 240W still demands a chassis with strong airflow and a power delivery system capable of sustaining that load under full multi-threaded stress.

For system integrators, the cooling tier is enterprise-grade, not consumer air cooling. The lack of an unlocked multiplier means no overclocking headroom, so the TDP represents the maximum sustained power draw under load, and thermal management should be planned for continuous operation at that level. The die size of 8x 81 mm² indicates a multi-chiplet design, which spreads heat across the substrate, but the total package still necessitates a cooler with a high static pressure fan and a large heatsink, particularly in dense server racks where ambient temperatures can be elevated.

Single-Thread vs Multi-Thread Behavior

The EPYC 7663P exhibits a stark contrast between single-thread and multi-thread performance potential, driven by its 2000 MHz base clock and 3500 MHz boost clock. Single-thread performance is limited by the modest boost clock compared to high-frequency consumer or workstation chips, and the Zen 3 architecture, while efficient, does not compensate for the lower clock speed in lightly threaded tasks. This means applications that rely on one or two cores, such as legacy software, certain simulation solvers, or interactive command-line tools, will perform below what a lower-core-count processor with a higher boost clock would offer.

Conversely, multi-thread performance is the processor's raison d'être, with 56 cores and 112 threads providing massive parallel throughput. The 256 MB L3 cache is a critical asset here, as it can hold substantial portions of a working set for many threads, reducing reliance on the eight-channel DDR4 memory. Real-world workloads like large-scale data processing, virtualization hosts running many VMs, or batch rendering will see near-linear scaling, making the single-thread deficit irrelevant for those use cases. The split implies that buyers must prioritize thread-hungry applications to justify the platform's power and cost.

Platform and Compatibility

The EPYC 7663P is built for AMD Socket SP3, a mature platform that supports the EPYC 7003 series, and it is compatible with existing SP3 motherboards that have received BIOS updates for Milan processors. Memory support is limited to DDR4, which is the previous generation, but the eight-channel bus offers 204.8 GB/s of bandwidth, which is adequate for feeding 56 cores in most workloads. The processor provides 128 PCIe Gen 4 lanes from the CPU itself, enabling high-speed connectivity for GPUs, NVMe storage, and network adapters without needing a separate chipset for expansion.

Upgrade path considerations are limited by the socket's longevity, as SP3 is not forward-compatible with newer EPYC generations that use different sockets. The production status is Active, so the processor is still available, but buyers should be aware that the platform is at the end of its architectural lifecycle. The lack of integrated graphics means a discrete GPU is required for display output, which is standard for server platforms. The 7nm process and 33,200 million transistor count indicate a mature design, and the 128 PCIe Gen 4 lanes support a wide range of accelerators, making this a viable choice for building a single-socket workstation or a dual-socket server where the 7663P sits as a high-core-count option.

The Intel Equivalent of EPYC 7663P

Looking for a similar processor from Intel? The Intel Core i5-14600KF offers comparable performance and features in the Intel lineup.

Intel Core i5-14600KF

Intel • 14 Cores

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