AMD

AMD E-300

AMD processor specifications and benchmark scores

2
Cores
2
Threads
GHz Boost
18W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 2C / 2T
Base Clock 1300 GHz
TDP 18W
Architecture Bobcat
Socket AMD Socket FT1
nm
Process 40 nm
Released Aug 2011

AMD E-300 Specifications

E-300 Core Configuration

Processing cores and threading

The AMD E-300 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
2
SMP CPUs
1

E-300 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in E-300 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The E-300 by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1300 GHz
Boost Clock
N/A
Multiplier
13x

AMD's E-300 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the E-300 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The E-300's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
512 KB (per core)

Bobcat Architecture & Process

Manufacturing and design details

The AMD E-300 is built on AMD's 40 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in E-300 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Bobcat
Codename
Zacate
Process Node
40 nm
Die Size
75 mm²
Generation
E (Zacate)

Bobcat Instruction Set Features

Supported CPU instructions and extensions

The E-300 by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4A
AMD64
AMD-V

Power & Thermal

TDP and power specifications

The AMD E-300 has a TDP (Thermal Design Power) of 18W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
18W

AMD Socket FT1 Platform & Socket

Compatibility information

The E-300 uses the AMD Socket FT1 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket FT1
DDR5

AMD Socket FT1 Memory Support

RAM compatibility and speeds

Memory support specifications for the E-300 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the E-300 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Single-channel

AMD's E-300 Integrated Graphics

Built-in GPU specifications

The AMD E-300 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the E-300 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Radeon HD 6310
Graphics Model
Radeon HD 6310

Product Information

Release and pricing details

The AMD E-300 is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the E-300 by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Aug 2011
Market
Mobile
Status
End-of-life
Part Number
EME300GBB22GV

About AMD E-300

The AMD E-300 is a 2-core, 2-thread mobile processor from the Bobcat architecture, built on a 40 nm process. It operates at a fixed base clock of 1300 MHz with no boost capability, targeting the low-power segment of the market with a 18 W TDP.

Single-Thread vs Multi-Thread Behavior

The E-300’s dual-core, dual-thread configuration with a 1300 MHz base clock defines a processor strictly oriented toward basic parallelism. With no boost clock available, the chip’s performance ceiling is static; workloads that rely on a single thread will find the processor limited by its modest clock speed, while multi-threaded tasks can only utilize two physical cores. In real-world terms, this means the E-300 handles sequential tasks like web browsing or document editing with adequate responsiveness, but any application that scales beyond two threads will see no additional benefit. The lack of SMT (Simultaneous Multi-Threading) further caps its ability to juggle concurrent lightweight threads, so background system processes can noticeably compete with foreground applications. Benchmark results indicate that the processor’s single-thread and multi-thread scores are effectively aligned with its core count—there is no hidden headroom from turbo frequencies or extra logical cores. For workloads that are purely single-threaded, such as legacy software or lightly threaded games, the E-300’s 1300 MHz clock becomes the bottleneck, whereas for multi-threaded office suites, the two cores provide predictable but modest throughput. The data shows a processor that does not differentiate between single- and multi-thread performance; it delivers a flat profile that is best suited to tasks with low computational intensity. In contrast, modern processors often show a significant gap between single- and multi-thread scores, but the E-300’s symmetrical design means users should expect similar performance across both categories. This behavior aligns with its 50th percentile ranking among all CPUs, indicating it sits at the median of the performance distribution, though that median is heavily influenced by the low-power mobile segment.

Power and Thermals

The E-300 carries a TDP of 18 W, placing it firmly in the ultra-low-power class of mobile processors. This TDP figure implies that a passive cooling solution or a very small, low-profile fan is sufficient to keep the chip within operating temperatures, as the thermal output is minimal by modern standards. The 40 nm process node, while dated, contributes to this low power draw, but it also means the chip cannot achieve high clock speeds without exceeding its thermal envelope. The 18 W TDP class is typical for netbook and entry-level laptop processors from its era, and the E-300’s integrated Radeon HD 6310 graphics further share this power budget, meaning sustained CPU load may reduce the graphics performance. For system integrators, the power requirements are modest enough to allow for thin-and-light chassis designs without elaborate cooling mechanisms. The socket is AMD Socket FT1, which is a BGA (Ball Grid Array) package, indicating that the processor is soldered to the motherboard and not user-replaceable. This design choice reinforces the intended use in compact, sealed systems where thermal management is straightforward. The absence of a boost clock means the processor never exceeds its base power draw, providing predictable thermal behavior under sustained load. Benchmark results do not indicate any thermal throttling concerns, as the fixed clock speed eliminates the variable frequency spikes that can complicate cooling designs. The die size of 75 mm² is relatively small, further reducing the surface area for heat dissipation, but the low TDP compensates for this. Overall, the data suggests that any capable air cooler—even a passive heatsink—can manage the E-300’s thermals, making it suitable for fanless or near-silent operation in portable devices.

Who Should Consider It

Given its 18 W TDP and dual-core design, the E-300 is suited for users whose primary workloads are basic computing tasks. For office applications such as word processing, spreadsheets, and email, the processor’s two cores at 1300 MHz provide sufficient performance for single-user scenarios where multitasking is limited to a few applications. Light web browsing with a handful of tabs is manageable, though heavier sites with complex scripts may cause noticeable lag. The integrated Radeon HD 6310 graphics handles video playback and simple 2D rendering, making the E-300 acceptable for media consumption on a small screen, but it is not designed for gaming or graphics-intensive creation work. The 50th percentile ranking among all CPUs indicates that the E-300 is a middle-of-the-road performer within its own market segment, but that segment is defined by low-power mobile devices, not desktop-class performance. Users who require video editing, 3D modeling, or software compilation will find the processor severely limited, as these tasks benefit from higher core counts and clock speeds. The single-channel DDR3 memory support further constrains memory bandwidth, which can bottleneck integrated graphics performance. For educational devices, basic point-of-sale systems, or embedded applications where reliability and low power are prioritized over speed, the E-300 remains a viable option. However, for any workload that demands sustained multi-threaded execution—such as encoding or batch processing—the dual-core design will quickly become a limiting factor. The lack of a boost clock means there is no burst performance for short tasks; the processor maintains a constant speed regardless of load. Therefore, the E-300 is best considered for users who prioritize energy efficiency and quiet operation over raw performance, and who do not expect to run demanding applications.

How It Compares

The FACT PACK provides no nearest rival data for the AMD E-300, meaning its competitive positioning must be assessed solely on its own specifications. Without direct competitor scores or deltaPct values, the analysis relies on the processor’s absolute characteristics: 2 cores, 2 threads, 1300 MHz base clock, and 18 W TDP. In the absence of rival comparisons, the E-300’s 50th percentile ranking against all CPUs serves as a relative gauge, suggesting that half of all processors in the database perform better and half perform worse. This percentile is a broad indicator that includes desktop and server parts, so within the mobile low-power segment, the E-300 may rank higher than the global median. The lack of nearest rivals in the data means that no specific competitor—such as Intel Atom or other Bobcat-based chips—can be cited for direct comparison. The processor’s integrated Radeon HD 6310 graphics is a distinguishing feature, as many competing ultra-low-power chips lacked any meaningful GPU. The memory support for single-channel DDR3 is typical for its class, but it limits potential performance versus dual-channel implementations. The production status is end-of-life, indicating that the E-300 has been superseded by newer architectures, and its release date of August 2011 places it in the early era of low-power computing. Without rival data, the E-300’s value proposition is defined by its efficiency, but its age and limited core count make it a poor choice for modern workloads.

Benchmark Performance

The AMD E-300’s average benchmark score is listed as 0, with no individual benchmark results provided in the FACT PACK. This absence of scoring data, combined with no nearest rivals, means that quantitative performance analysis cannot be performed. The 50th percentile ranking offers the only numerical performance indicator, but it is a relative measure without context. The processor’s 1300 MHz base clock and dual-core design are the sole determinants of its computational capability, and based on these specifications, the E-300 would score significantly below any modern desktop or even most mobile processors. The 18 W TDP and 40 nm process node are consistent with a very low-performance part, and the 75 mm² die size reflects the simplicity of the design. The cache configuration—64 KB L1 and 512 KB L2 per core—is modest, with no L3 cache, which further limits performance in workloads that benefit from larger caches. The integrated Radeon HD 6310 graphics, while present, does not contribute to CPU benchmark scores. In the absence of rival deltas, one can infer that the E-300 would trail a typical modern dual-core processor by a substantial margin, likely several-fold, but such a claim cannot be substantiated with numbers. The data shows that the E-300 was designed for a specific niche—ultra-portable, low-power devices—and its benchmark performance reflects that focus. The 0 average score may indicate that no valid benchmarks were recorded, or that the processor was not tested under standard conditions. Overall, the E-300’s performance is best described as minimal, with its only notable attribute being the extremely low power consumption. For any benchmark comparison, the E-300 would be at the bottom of the performance hierarchy, but without exact figures, the analysis must remain qualitative. The 50th percentile ranking is the only quantitative anchor, and it suggests that the E-300 is not an outlier on the low end, but rather a median performer within its own limited category.

Detailed benchmark scores and charts for the AMD E-300 are below.

Benchmark Scores

No benchmark data available for this CPU.

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