CPU Comparison

A

AMD

AMD

AMD Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,865

625

cinebench_cinebench_r15_singlecore

404

88

cinebench_cinebench_r20_multicore

11,938

2,608

cinebench_cinebench_r20_singlecore

1,685

367

cinebench_cinebench_r23_multicore

28,424

6,210

cinebench_cinebench_r23_singlecore

4,012

876

passmark_data_compression

399,839

332,960

passmark_data_encryption

19,947

3,455

passmark_extended_instructions

33,915

18,359

passmark_find_prime_numbers

169

10

passmark_floating_point_math

72,648

29,356

passmark_integer_math

108,717

84,874

passmark_multithread

33,441

7,306

passmark_physics

1,772

198

passmark_random_string_sorting

41,537

8,956

passmark_single_thread

4,052

460

passmark_singlethread

4,052

460

DETAILED SPECIFICATIONS

SPECIFICATION

AI Max PRO 385

Phi 7210

Core Specs

Cores

8

64 +700.0%

Threads

16

256 +1500.0%

Base Clock (GHz)

3.6

1,300 +36011.1%

Boost Clock (GHz)

5

1,500 +29900.0%

Frequency (GHz)

3.6

1,300 +36011.1%

Turbo Clock (GHz)

5

1,500 +29900.0%

Multiplier

36

13 -63.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

32 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

32 MB (shared)

—

Power

TDP (W)

55

215 +290.9%

Configurable TDP

45-120 W

—

Architecture

Architecture

Zen 5

Knights Landing

Codename

Strix Halo

Knights Landing

Generation

Ryzen AI Max (Zen 5 (Strix Halo))

Xeon Phi (Knights Landing)

Process Size

4 nm

14 nm

Transistors

—

8,000 million

Foundry

TSMC

Intel

Memory

Memory Support

LPDDR5X

DDR4

Memory Bus

Quad-channel

—

Memory Bandwidth

256.0 GB/s

—

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP11

Intel Socket 3647

PCIe

Gen 4, 16 Lanes(CPU only)

—

AI/NPU

NPU

Yes / 50 TOPS

—

Graphics

Integrated Graphics

Radeon 8050S

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000001422

SR2MESR2X4

Package

FC-BGA

FC-LGA3647

Tj Max

100°C

—

View Ryzen AI Max PRO 385 Details View Xeon Phi 7210 Details