CPU Comparison

A

AMD

AMD

AMD EPYC 8124P

CORE STATE Siena

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.45 Base / 3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 125W

ARCHITECTURE Zen 4c

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen AI 9 HX 370

CORE STATE Strix Point

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 2000 Base / 5.1 GHz Turbo

CACHE 16 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE —

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,085

3,010

cinebench_cinebench_r15_singlecore

435

425

cinebench_cinebench_r20_multicore

12,856

12,545

cinebench_cinebench_r20_singlecore

1,814

1,771

cinebench_cinebench_r23_multicore

30,611

29,870

cinebench_cinebench_r23_singlecore

4,321

4,217

passmark_data_compression

468,411

445,719

passmark_data_encryption

30,743

22,252

passmark_extended_instructions

29,666

31,653

passmark_find_prime_numbers

222

126

passmark_floating_point_math

72,395

76,892

passmark_integer_math

123,513

122,933

passmark_multithread

36,014

35,148

passmark_physics

3,356

1,881

passmark_random_string_sorting

64,067

48,723

passmark_single_thread

2,271

3,973

passmark_singlethread

2,271

3,973

3dmark_16_threads

N/A

9,365

3dmark_2_threads

N/A

2,179

3dmark_4_threads

N/A

3,970

3dmark_8_threads

N/A

6,992

3dmark_max_threads

N/A

9,725

3dmark_single_thread

N/A

1,153

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 8124P

AI 9 HX 370

Core Specs

Cores

16

12 -25.0%

Threads

32

24 -25.0%

Base Clock (GHz)

2.45

2,000 +81532.7%

Boost Clock (GHz)

3

5.1 +70.0%

Frequency (GHz)

2.45

2,000 +81532.7%

Turbo Clock (GHz)

3

5.1 +70.0%

Multiplier

24.5

20 -18.4%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

16 MB

Power

TDP (W)

125

28 -77.6%

Configurable TDP

120-150 W

15-54 W

Architecture

Architecture

Zen 4c

Zen 5

Codename

Siena

Strix Point

Generation

EPYC (Zen 4c (Siena))

Ryzen AI (Zen 5)

Process Size

5 nm

4 nm

Transistors

17,750 million

—

Die Size

2x 73 mm²

233 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5, LPDDR5X

Memory Bus

Six-channel

Dual-channel

Memory Bandwidth

230.4 GB/s

89.6 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket SP6

AMD Socket FP8

PCIe

Gen 5, 96 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 8

E-Core Frequency

—

1400 MHz up to 3.3 GHz

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 890M

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$639

—

Part Number

100-000001135

100-000000994

Package

FC-LGA4844

FP8

Tj Max

—

100°C

Bundled Cooler

None

—

View EPYC 8124P Details View Ryzen AI 9 HX 370 Details